A research team at the University of Tokyo has developed a brand new cooling solution that uses the phase change of water to improve heat dissipation efficiency. As per foreign media reports, when water changes from a liquid to a gas (i.e., boils), it absorbs seven times more energy than simply flowing water, making it significantly more effective at absorbing and releasing heat compared to conventional water cooling techniques.
However, since the coolant flows through tiny capillary channels built into the chip, water vapor often struggles to pass through these narrow passages, reducing the expected efficiency.
The researchers employed 3D microfluidic channels combining capillary structures and a distribution layer. They found that the shape of the microchannels and the method of coolant distribution had a significant impact on the overall thermal and fluid performance. This design enabled a stable and continuous flow of both water and steam, achieving a coefficient of performance (COP) of 100,000—roughly ten times that of traditional single-phase water cooling.
Industry experts noted that thermal management for high-power electronic devices is crucial for the advancement of next-generation technologies. This design may create new chances for achieving the required cooling capacity. It also offers the potential for more compact cooling systems that don’t rely on expensive or specialized coolants.
Moreover, this technology could address heat dissipation challenges in high-performance computing (HPC) and be applied in other areas such as lasers, photodetectors, LEDs, and radar systems. It could even extend to automotive and aerospace industries. The system also has the potential for passive operation, utilizing natural convection generated during the liquid’s phase change, eliminating the need for any pump mechanisms.
As chips become smaller year by year and generate increasingly concentrated heat in tiny areas, cooling technologies must innovate to keep pace with semiconductor development. Some novel active cooling solutions have already entered the market, such as Frore’s AirJet Mini Slim and Ventiva’s ionic cooling engine.
(Photo credit: the University of Tokyo)
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